Finetech FINEPLACER -96 "LAMBDA" P230406049

Finetech FINEPLACER -96 "LAMBDA" base module + die flip & die pick up module + UV loctite

Price on request

Manufacturer	Finetech
Model	FINEPLACER -96 "LAMBDA"
Year
Location	Malaysia
Category	Semiconductor - Test and measurement equipment
Product id	P230406049
Language	Základní modul + vyklápěcí a snímací modul + UV loctite Finetech FINEPLACER -96 "LAMBDA" Finetech FINEPLACER -96 "LAMBDA" Basismodul + Die-Flip- & Die-Pick-up-Modul + UV-Loctite Finetech FINEPLACER -96 "LAMBDA" base module + die flip & die pick up module + UV loctite Módulo base + módulo de volteo y recogida de troquel + loctite UV Finetech FINEPLACER -96 "LAMBDA" Module de base + module de retournement de matrice et de ramassage de matrice + loctite UV Finetech FINEPLACER -96 "LAMBDA" Modulo base + modulo die flip & die pick up + loctite UV Finetech FINEPLACER -96 "LAMBDA" Moduł podstawowy + moduł odwróć i podnieś matrycę + Loctite UV Finetech FINEPLACER -96 "LAMBDA" Finetech FINEPLACER -96 "LAMBDA" Базовый модуль + модуль переворота и захвата матрицы + УФ-локтит Temel modül + kalıp çevirme ve kalıp alma modülü + UV loctite Finetech FINEPLACER -96 "LAMBDA"

Base module + die flip & die pick up module + UV loctite

The completely revised table top die bonding platform can be easily configured for a wide range of applications for
process development or prototyping. Numerous process module options and in-field-retrofit capabilities guarantee
maximum technological flexibility of the table top die bonder to protect your investment in the face of ever-changing
challenges.

Due to the table top flip chip bonder’s ergonomic machine design and software-supported user guidance, the user
remains at the center of action. Powerful optical systems allow the user to keep an overview at all times, even when
working in the sub-micron range.
The table top die bonder FINEPLACER® lambda shares a common module range and innovative operating software
with Finetech's automatic die bonding systems to ensure a seamless process migration to series production.

Features:
 Sub-micron placement accuracy
 Superior optical resolution
 Excellent price performance ratio
 Individual configurations with process modules
 Numerous bonding technologies (adhesive, soldering)
 Data/media logging and reporting function
 Wide range of controlled bonding forces
 Full process access & easy visual programming with touch screen interface
 Various bonding technologies in one recipe
 Process module compatibility across Finetech platforms
 In-situ process observation in HD
 Modular machine platform allows in-field retrofitting during entire service life
 Synchronized control of all process related parameters
 Overlay vision alignment system (VAS) with fixed beam splitter
 Sequence control with predefined parameters

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. Exapro recommends to check the details with the seller before a purchase

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Worked hours
Hours under power
State	in working conditions
At local norms	---------
Status	packed

Client type	User – small or medium company
Active since	2023
Offers online	12
Last activity	May 16, 2023

Description

Specifications

-------------------
Worked hours
Hours under power
State	in working conditions
At local norms	---------
Status	packed

About this seller

Client type	User – small or medium company
Active since	2023
Offers online	12
Last activity	May 16, 2023

Finetech FINEPLACER -96 "LAMBDA" base module + die flip & die pick up module + UV loctite

Description

Specifications

About this seller

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